The Winners:
1. Netflix: +297%
Netflix's earnings have soared as the video subscription service attracts millions of new customers. Netflix's library has expanded quickly with original, widely acclaimed shows like House of Cards and Orange is the New Black.
2. Micron Technology: +243%
The Boise, Idaho-based semiconductor maker has been on a roll. Micron's chips, which are found in computers, cars and mobile devices, are benefiting from consolidation in the industry. Sales of its memory chips are booming.
3. Best Buy: + 237%
The electronics retailer has slashed costs, ramped up employee training and matched online prices to draw customers into its stores. Best Buy has been stepping up its game as it faces competition from discounters and online retailers like Amazon.com.
Top 10 Canadian Stocks To Invest In Right Now: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Jeff Reeves]
Next Page
Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
Top 5 Semiconductor Companies To Buy Right Now: Intel Corporation(INTC)
Intel Corporation engages in the design, manufacture, and sale of integrated circuits for computing and communications industries worldwide. It offers microprocessor products used in notebooks, netbooks, desktops, servers, workstations, storage products, embedded applications, communications products, consumer electronics devices, and handhelds. The company also provides system on chip products that integrate its core processing functionalities with other system components, such as graphics, audio, and video, onto a single chip. In addition, it offers chipset products that send data between the microprocessor and input, display, and storage devices, including keyboard, mouse, monitor, hard drive, and CD, DVD, or Blu-ray drives; motherboards designed for desktop, server, and workstation platforms, and that has connectors for attaching devices to the bus; and wired and wireless connectivity products consisting of network adapters and embedded wireless cards used to translate and transmit data across networks. Further, the company provides NAND flash memory products primarily used in portable memory storage devices, digital camera memory cards, and solid-state drives; software products comprising operating systems, middleware, and tools used to develop, run, and manage various enterprise, consumer, embedded, and handheld devices; and software development tools that enable the creation of applications. Additionally, it develops computing platforms, which are integrated hardware and software computing technologies designed to offer an optimized solution. The company sells its products principally to original equipment manufacturers, original design manufacturers, PC components and other products users, and other manufacturers of industrial and communications equipment. It has a strategic alliance with Scientific Conservation Inc. Intel Corporation was founded in 1968 and is based in Santa Clara, California.
Advisors' Opinion:- [By Alex Planes]
At the time, Fairchild was pioneering low-cost semiconductor manufacturing and was quickly moving toward leadership in a small and turbulent industry. The company had secured a prestige placement in the Apollo Guidance Computer, which would debut the following year -- and which was alluded to in Moore's paper: "Such programs as Apollo, for manned moon flight, have demonstrated the reliability of integrated electronics." However, it would not maintain its leadership for long, nor would Moore stick with the company he helped create. In 1968, Moore and fellow Fairchild alumnus Robert Noyce founded Intel (NASDAQ: INTC ) , the company now most closely associated with transistors, integrated circuits, and Moore's Law.
- [By Wallace Witkowski]
That�� just in time for a ramping up of earnings season. During the four-day trading week, which ends Thursday ahead of the Good Friday holiday, nine Dow components report quarterly results. Those Dow components include Coca-Cola Co. (KO) , Johnson & Johnson Inc. (JNJ) , and Intel (INTC) �on Tuesday; IBM (IBM) �and American Express Co. (AXP) �on Wednesday; with UnitedHealth Group Inc. (UNH) , General Electric Co. (GE) , Goldman Sachs Group Inc. (GS) , and DuPont (DD) �on Thursday.
- [By Stoyan Bojinov]
The Santa Clara-based semiconductor juggernaut Intel Corp. (INTC) revealed a slew of new products at this year’s Intel Developer Forum in San Francisco.
Intel unveiled a host of consumer electronics products that it hopes will catch on with the mobile revolution. One of the most exciting announcements was the first fanless ultrabook laptop, and the company plans to team up with tablet makers to gain a foothold in that market; by the upcoming U.S. holiday season, there should be more than 20 Android and Windows 8 tablets based on Intel’s new “Bay Trail” CPU. The company also plans to release a 20nm SoC chip for smartphones as well as number of “wearable” electronics including a watch as well as a bracelet based on Intel hardware.
Intel shares sank lower on Wednesday, shedding 0.76% on the day. The company is up nearly 11% YTD.
- [By Matt Thalman]
Onward to earnings reports
Shares of Microsoft (NASDAQ: MSFT ) , Hewlett-Packard (NYSE: HPQ ) , and Intel (NASDAQ: INTC ) all closed lower today as investors awaited Intel's second-quarter earnings report and a brief insight into what's happening within the PC industry. As the closing bell rang, shares of Microsoft had lost 1.46%, Hewlett-Packard was down 0.53%, and Intel slid lower by 0.41%.
Top 5 Semiconductor Companies To Buy Right Now: Applied Materials Inc.(AMAT)
Applied Materials, Inc. provides manufacturing equipment, services, and software to the semiconductor, flat panel display, solar photovoltaic (PV), and related industries worldwide. The company?s Silicon Systems Group segment offers a range of manufacturing equipment used to fabricate semiconductor chips or integrated circuits. This segment provides systems that perform primary processes used in chip fabrication, including atomic layer deposition, chemical vapor deposition, physical vapor deposition, electrochemical deposition, rapid thermal processing, chemical mechanical planarization, wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. Its Applied Global Services segment offers products and services designed to enhance the performance and productivity, and reduce the environmental impact of the fab operations of semiconductor, liquid crystal displays (LCDs), and solar P V manufacturers. The company?s Display segment provides products for manufacturing thin film transistor LCDs for televisions, personal computers (PCs), tablet PCs, smartphones, and other consumer-oriented electronic applications. Its Energy and Environmental Solutions segment offers manufacturing systems for the generation and conservation of energy, as well as manufacturing solutions for wafer-based crystalline silicon applications. This segment also provides roll-to-roll vacuum Web coating systems for deposition of a range of films on flexible substrates for functional, aesthetic, or optical properties; and roll-to-roll machine for depositing ultra-thin aluminum films for flexible packaging applications. The company serves manufacturers of semiconductor wafers and chips, flat panel LCDs, solar PV cells and modules, and other electronic devices. Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California.
Advisors' Opinion:- [By Ben Axler]
We also note there has been a healthy pace of M&A consolidation in the semiconductor capital equipment industry in the past few years. For example, ASML Holdings (ASML) recently acquired Cymer and Tokyo Electron Ltd. (TYO: 8038) acquired FSI International. Lastly, we noted previously that Applied Materials (AMAT) acquired Varian Semiconductor in 2011, a close competitor to Axcelis. Our analysis suggests that the minimum valuation for a company in the industry is 1.2x, 11.0x and 2.2x revenues, EPS, and tangible book value, respectively. Furthermore, the average premium paid to the stock price has been a minimum of 35%.
Top 5 Semiconductor Companies To Buy Right Now: Sunedison Inc (SUNE)
SunEdison Inc, formerly MEMC Electronic Materials, Inc., incorporated on October 1, 1984, is engaged in the development, manufacture and sale of silicon wafers. The Company is a developer and seller of photovoltaic energy solutions. Through Solar Materials and Solar Energy (SunEdison), it is a developer of solar energy projects. The Company operates in two segments: semiconductor materials and solar energy. The Company�� Solar Energy segment includes the operations of its old Solar Materials segment, as well as its SunEdison business. In the Semiconductor Materials, the Company offers wafers with a variety of features. The Company�� wafers vary in size, surface features, composition, purity levels, crystal properties and electrical properties.
Semiconductor Materials
The Company�� monocrystalline wafers for use in semiconductor applications range in size from 100 millimeter to 300 millimeter and are round in shape for semiconductor customers because of the nature of their processing equipment. Its wafers are used as the starting material for the manufacture of various types of semiconductor devices, including microprocessor, memory, logic and power devices. In turn, these semiconductor devices are used in computers, cellular phones and other mobile electronic devices, automobiles and other consumer and industrial products. Its monocrystalline wafers for semiconductor applications include four general categories of wafers: prime, epitaxial, test/monitor and silicon-on-insulator (SOI) wafers.
The Company�� prime wafer is a polished, pure wafer with an ultraflat and ultraclean surface. The Company�� epitaxial (epi), wafers consist of a thin silicon layer grown on the polished surface of the wafer. Typically, the epitaxial layer has different electrical properties from the underlying wafer. This provides customers with isolation between circuit elements than a polished wafer. Its AEGIS product is designed for certain specialized applications requiring high resis! tivity epitaxial wafers and its MDZ product feature. The AEGIS wafer includes a thin epitaxial layer grown on a standard starting wafer. The AEGIS wafer�� thin epitaxial layer eliminates harmful defects on the surface of the wafer, thereby allowing device manufacturers to increase yields. The Company supplies test/monitor wafers to its customers for use in testing semiconductor fabrication lines and processes. An SOI wafer is a different starting material for the chip making process.
Solar Energy
The Company�� Solar Energy segment provides solar energy services that integrate the design, installation, financing, monitoring, operations and maintenance portions of the downstream solar market to provide a solar energy service to its customers. As of December 31, 2012, SunEdison interconnected over 675 solar power systems representing 989 megawatt of solar energy generating capacity. As of December 31, 2012, SunEdison had 73 megawatt of projects under construction and 2.6 gigawatts in pipeline. In support of its downstream solar business, its Solar Energy segment manufactures polysilicon, silicon wafers and solar modules. Additionally, its Solar Energy segment will sell solar modules to third parties in the event the opportunity aligns with itsinternal needs. It provides its downstream customers with a way to purchase renewable energy by delivering solar power under long-term power purchase arrangements with customers or feed-in tariff arrangements with government entities and utilities. Its SunEdison business is dependent upon government subsidies, including United States federal incentive tax credits, state-sponsored energy credits and foreign feed-in tariffs. The Company�� solar wafers are used as the starting material for crystalline solar cells.
The Company competes with Shin-Etsu Handotai, SUMCO, Siltronic and LG Siltron, SunPower Corporation, First Solar, Inc., Enerparc, Sharp Corporation (Recurrent Energy), Phoenix Solar, BELECTRIC, JUWI Solar Gmbh, and S! olar City! .
Advisors' Opinion:- [By Lauren Pollock]
SunEdison Inc.(SUNE) said Monday it will move its semiconductor crystal operations out of the U.S. and close its polysilicon manufacturing facility in Merano, Italy, which will affect more than 300 employees.
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